Reliability Growth Management
Quality & Inspection Standards
PRODUCTS CENTER
Get Custom Quote
PRODUCTS CENTER
Reliability Growth Management Under GJB9001C
Reliability growth management is a systematic process for improving product reliability through the identification and correction of design and manufacturing deficiencies. GJB9001C-2017 requires organizations to "determine qualitative and quantitative requirements for general quality characteristics" and "conduct general quality characteristics analysis, design, and verification, and propose and implement preventive and improvement measures." GJB 450 — the foundational standard for equipment reliability work — establishes reliability growth as a core reliability work activity, implemented through Work Item 403 (Reliability Growth Test) and the TAAF (Test-Analyze-And-Fix) process. GJB 1407 provides the specific requirements for planning, conducting, and evaluating reliability growth tests.
For PCB manufacturers, reliability growth management is essential for achieving the high reliability levels required by military and aerospace applications. Through systematic testing, failure analysis, and design improvement — the core TAAF cycle — organizations can progressively increase the reliability of PCB designs, materials, and manufacturing processes. This guide provides a complete implementation roadmap covering the standard requirements, the TAAF process, growth models, FRACAS integration, PCB-specific applications, and audit preparation.
Engineering Summary
- Reliability growth is achieved through the TAAF (Test-Analyze-And-Fix) process — a systematic cycle of testing, failure analysis, and design improvement.
- GJB 450 Work Item 403 establishes reliability growth test requirements for exposing latent defects and implementing corrective actions.
- GJB 1407 provides the specific standard for planning, conducting, and evaluating reliability growth tests.
- Reliability growth must be planned with clear growth targets, growth models, and milestone reviews.
- FRACAS (Failure Reporting and Corrective Action System) is the essential mechanism for capturing and tracking failures throughout the growth process.
- For PCB manufacturers, reliability growth covers design improvements, material selection, process optimization, and manufacturing defect reduction.
- Reliability growth is a lifecycle activity — it should begin in early development and continue through production and field support.
1. What Auditors Check — A Quick Overview
| Audit Focus | What External Auditors Verify | Expected Evidence |
|---|---|---|
| Growth Planning | Is reliability growth planned with clear targets and growth models? | Reliability growth plan, growth targets, milestone schedule |
| TAAF Implementation | Is the TAAF process implemented and documented? | Test records, failure analysis reports, design change records |
| FRACAS Integration | Is a FRACAS system established and used for failure tracking? | FRACAS records, failure reports, corrective action tracking |
| Growth Verification | Is reliability growth verified through test and analysis? | Growth test results, reliability predictions, qualification test reports |
| Corrective Action Effectiveness | Are corrective actions verified effective before closure? | Corrective action verification records, re-test results |
| Documentation | Are growth activities and results documented and retained? | Growth reports, test documentation, change records |
KEY INSIGHT:
Reliability growth management is a critical audit focus area. Auditors will verify that reliability growth is systematically planned and executed through the TAAF process, that FRACAS is used for failure tracking, and that growth is verified through test and analysis.
2. Standard Requirements for Reliability Growth Management
2.1 GJB9001C — General Quality Characteristics
GJB9001C-2017 establishes the overarching requirement for reliability improvement through its general quality characteristics provisions:
"In accordance with GJB 450, GJB 368, GJB 3872, GJB 2547, GJB 900, GJB 4239, and GJB 1909, determine qualitative and quantitative requirements for general quality characteristics and work item requirements, develop general quality characteristics work plans; in conjunction with system design, comprehensively trade off and allocate general quality characteristics requirements, conduct general quality characteristics analysis, design, and verification, and propose and implement preventive and improvement measures."
This requirement mandates proactive identification and implementation of improvement measures — including reliability growth activities — throughout the product lifecycle.
2.2 GJB 450 — Work Item 403 (Reliability Growth Test)
GJB 450 establishes reliability growth test as Work Item 403:
- Purpose (8.3.1): To expose latent defects in the product and implement corrective actions by applying integrated environmental stresses simulating actual use conditions, so that product reliability reaches specified requirements
- Work Item Points (8.3.2): Reliability growth tests should have clear growth targets and growth models, with emphasis on failure analysis and effective design changes
- Failure Mode Focus: To improve mission reliability, corrective actions should focus on failure modes affecting mission success; to improve basic reliability, corrective actions should focus on frequently occurring failure modes
- Standard Compliance: Reliability growth tests shall be conducted in accordance with GJB 1407
- Reviews: Reviews must be conducted before and after reliability growth tests; intermediate reviews should be arranged as needed
2.3 GJB 1407 — Reliability Growth Test
GJB 1407 is the specific standard for reliability growth testing:
- Purpose: To purposefully stimulate failures, analyze failures, improve design, and demonstrate the effectiveness of improvements
- Nature: A continuous closed-loop process of "expose failure → analyze cause → correct and improve → verify effectiveness"
- Application: Used for military electronic systems or equipment during the engineering development phase
- Position: Reliability growth test is a work item of GJB 450 and the formal pathway and primary means for achieving reliability growth
- Lifecycle Applicability: Reliability growth spans all stages of the product lifecycle, with different methods and techniques applicable at different stages
2.4 FRACAS — Failure Reporting and Corrective Action System
GJB 841 establishes FRACAS as the mechanism for capturing and tracking failures:
- Failure reporting and corrective action system (FRACAS) is a closed-loop system for reporting, analyzing, and correcting failures
- All failures occurring during reliability growth testing must be included in FRACAS
- FRACAS ensures that failures are documented, root causes are identified, corrective actions are implemented, and recurrence is prevented
- FRACAS is the essential mechanism for tracking failures throughout the TAAF process
3. The TAAF Process — Test, Analyze, and Fix
The TAAF (Test-Analyze-And-Fix) process is the fundamental engine of reliability growth. It is a systematic, iterative cycle of testing to identify failures, analyzing to determine root causes, and implementing fixes to prevent recurrence.
3.1 The TAAF Cycle
| Phase | Activities | PCB Example |
|---|---|---|
| Test | Apply environmental stresses (thermal cycling, vibration, electrical stress) to expose latent defects. Monitor performance and record failures. | Conduct thermal cycling of PCB assemblies (-55°C to +125°C, 100 cycles) to expose solder joint and via failures. |
| Analyze | Perform failure analysis to identify root causes. Use structured methodologies (5 Whys, fishbone, FMEA) to determine underlying causes. | Analyze failed solder joints using microsection and SEM; determine root cause is insufficient solder volume and poor wetting. |
| Fix | Develop and implement corrective actions. Update design, process, or material specifications. Verify effectiveness through re-test. | Update soldering profile, increase solder paste volume, and retrain operators; verify through re-testing of subsequent assemblies. |
3.2 The Reliability Growth Cycle
Reliability growth occurs across three lifecycle phases:
- Development Phase: First prototypes have low initial MTBF (Point A). Through reliability growth testing and other tests, failures are exposed and corrected through design changes. Reliability grows throughout development to Point B
- Pilot Production Phase: Initial production may show lower reliability than development samples (Point B to Point C) due to manufacturing variations. Through continued corrective actions, reliability grows to Point D
- Production and Field Phase: Initial production may have process and assembly defects (Point D to Point E). As issues are resolved, reliability grows to the specified MTBF
Reliability growth is the result of repeated design and correction cycles. As design matures, efforts should focus on identifying and correcting actual (through testing) or potential (through analysis) failure sources.
3.3 Information Sources for Reliability Growth
Reliability growth can be driven by three information sources:
- Empirical Information (Experience): Similar product field data, historical reliability growth experience, historical data, technical expertise, and databases
- Analytical Information: Feasibility studies, trade-off analyses, reliability predictions, FMECA, fault tree analysis, and design review findings
- Test Information: Reliability growth test results, environmental test results, qualification test results, and field performance data
4. Reliability Growth Management Process — A Step-by-Step Approach
Reliability growth management translates the TAAF process into a structured, managed program of activities throughout the product lifecycle.
4.1 The Management Process — Nine Steps
| Step | Activity | PCB Example |
|---|---|---|
| 1 | Define Growth Goals — Establish reliability growth targets based on product requirements. Define initial, interim, and final MTBF or reliability targets. | Define PCB growth goals: Initial MTBF 50,000 hours → Interim 100,000 hours → Final 200,000 hours by production release. |
| 2 | Select Growth Model — Choose an appropriate reliability growth model (e.g., Duane model, AMSAA model) for planning and tracking growth. | Select Duane model for PCB reliability growth tracking; define growth rate parameter. |
| 3 | Plan Growth Test — Develop reliability growth test plan per GJB 1407. Define test profile, sample size, success criteria, and milestone reviews. | Plan PCB growth test: 10 PCB assemblies, thermal cycling + vibration + electrical stress, 500-hour test duration, pre- and post-test reviews. |
| 4 | Conduct Growth Test — Execute the reliability growth test per the test plan. Monitor failures and document all failure events. | Conduct PCB growth test; monitor and record all failures (solder joint cracks, via failures, component failures). |
| 5 | Perform Failure Analysis — For each failure, conduct root cause analysis using structured methodologies. Document findings in FRACAS. | Analyze each PCB failure; determine root causes (e.g., insufficient solder volume, via cracking, component overstress). |
| 6 | Implement Corrective Actions — Develop and implement corrective actions for each root cause. Update designs, processes, or materials as needed. | Implement corrective actions: increase solder paste volume, improve via design, select higher-rated components. |
| 7 | Verify Corrective Action Effectiveness — Verify that corrective actions are effective through re-test or analysis. Close FRACAS items only after verification. | Verify corrective actions through re-test of updated PCB assemblies; confirm failures eliminated or reduced. |
| 8 | Track Growth Progress — Monitor reliability growth against the growth model. Update predictions and adjust plans as needed. | Track PCB MTBF growth against Duane model; predict final MTBF; adjust test plan if needed. |
| 9 | Conduct Reviews — Conduct pre-test and post-test reviews per GJB 450 requirements. Document growth results and lessons learned. | Conduct PCB growth test reviews; document growth achieved, lessons learned, and remaining issues. |
4.2 FRACAS Integration
FRACAS is the essential infrastructure for reliability growth management. All failures identified during growth testing must be documented, tracked, and resolved through FRACAS:
- Failure Reporting: Document each failure with detailed description, test conditions, and failure mode
- Failure Analysis: Conduct root cause analysis using 5 Whys, fishbone, or FMEA methodologies
- Corrective Action: Develop and implement corrective actions to address root causes
- Verification: Verify corrective action effectiveness through re-test or analysis
- Closure: Close FRACAS items only after corrective action is verified effective
- Trend Analysis: Monitor failure trends to identify systemic issues and growth progress
5. PCB-Specific Reliability Growth Management — Practical Implementation
For PCB manufacturers, reliability growth management addresses design, material, process, and manufacturing issues that affect PCB reliability.
5.1 PCB Reliability Growth Focus Areas
| Focus Area | Typical Failures | Growth Actions |
|---|---|---|
| Design | Impedance mismatch, signal integrity issues, thermal stress, component spacing | Design rule updates, stackup optimization, thermal via addition, design rule check (DRC) improvement |
| Materials | Laminate delamination, CAF failures, solderability issues, material inconsistencies | Material specification updates, alternative material qualification, incoming inspection enhancement |
| Processes | Solder joint defects, plating voids, etching variations, drilling defects | Process parameter optimization, SPC implementation, operator training, equipment upgrades |
| Assembly | Component misalignment, insufficient solder, bridging, tombstoning | Soldering profile optimization, stencil design improvement, placement accuracy enhancement |
5.2 PCB Reliability Growth Example
| Phase | Activity | Outcome |
|---|---|---|
| Initial | Initial PCB design fabricated and assembled | Initial MTBF: 30,000 hours (estimated) |
| Growth Test 1 | Conduct reliability growth test (thermal cycling + vibration). Identify failures: solder joint cracks, via failures. | Failures documented in FRACAS; root causes identified (insufficient solder volume, inadequate via design). |
| Corrective Action 1 | Increase solder paste volume; improve via design (increase pad size, add thermal relief). | Corrective actions implemented and documented. |
| Growth Test 2 | Re-test updated PCBs. Identify remaining failures: component overstress, laminate delamination. | Solder joint failures eliminated; new failures documented in FRACAS. |
| Corrective Action 2 | Select higher-rated components; improve laminate material (increase Tg, reduce CTE). | Corrective actions implemented and documented. |
| Growth Test 3 | Re-test updated PCBs. All failures eliminated or within acceptable limits. | Final MTBF: 200,000 hours (verified). Growth target achieved. |
| Production Release | Release design and processes to production | Reliability growth complete; production monitoring continues. |
6. Key Control Points in PCB Reliability Growth Management
6.1 Growth Planning
- Establish clear reliability growth targets with defined initial, interim, and final values
- Select appropriate growth models (e.g., Duane, AMSAA) for tracking and prediction
- Develop growth test plans per GJB 1407 with defined test profiles and success criteria
- Schedule pre-test and post-test reviews per GJB 450 requirements
6.2 TAAF Execution
- Conduct reliability growth testing with appropriate environmental stresses (thermal cycling, vibration, electrical stress)
- Perform thorough failure analysis using structured methodologies (5 Whys, fishbone, FMEA)
- Focus corrective actions on failure modes affecting mission reliability and frequently occurring failures
- Implement corrective actions and verify effectiveness through re-test or analysis
6.3 FRACAS Implementation
- Establish FRACAS per GJB 841 for capturing and tracking all failures
- Document all failures with detailed descriptions and test conditions
- Track corrective actions from identification through verification and closure
- Use FRACAS data for trend analysis and growth monitoring
6.4 Growth Monitoring and Verification
- Monitor reliability growth against the growth model throughout the program
- Update reliability predictions based on test results and growth progress
- Verify that growth targets are achieved before production release
- Document growth results and lessons learned for future programs
6.5 Documentation and Records
- Retain growth test plans, test results, and failure analysis reports
- Maintain FRACAS records for all failures and corrective actions
- Document growth reviews and milestone decisions
- Ensure records are complete, traceable, and retained per requirements
7. Reliability Growth Audit Checklist — Key Areas to Verify
| Audit Area | Verification Points |
|---|---|
| Growth Planning | Growth targets defined; growth model selected; growth test plan documented per GJB 1407; pre- and post-test reviews scheduled |
| TAAF Process | Testing conducted with appropriate stresses; failure analysis performed; corrective actions implemented and verified |
| FRACAS | FRACAS established and implemented; failures reported and tracked; corrective actions closed only after verification |
| Growth Verification | Growth progress tracked against model; targets verified before production release; test results documented |
| Documentation | Test plans, results, failure analysis reports, FRACAS records, and review documentation retained |
8. Audit Preparation Checklist for PCB Manufacturers
| # | Check Item | Clause/Standard | Status | Notes |
|---|---|---|---|---|
| Growth Planning | ||||
| 1 | Reliability growth targets are defined and documented | GJB 450 8.3 | ☐ | |
| 2 | Growth model is selected and documented | GJB 450 8.3 | ☐ | |
| 3 | Growth test plan per GJB 1407 is documented | GJB 1407 | ☐ | |
| TAAF Process | ||||
| 4 | Reliability growth testing is conducted | GJB 450 8.3 | ☐ | |
| 5 | Failure analysis is conducted for all failures | GJB 450 8.3 | ☐ | |
| 6 | Corrective actions are implemented and verified | GJB 450 8.3 | ☐ | |
| FRACAS | ||||
| 7 | FRACAS is established and implemented | GJB 841 | ☐ | |
| 8 | All failures are documented in FRACAS | GJB 450 8.3 | ☐ | |
| Growth Verification | ||||
| 9 | Growth progress is tracked against the growth model | GJB 450 8.3 | ☐ | |
| 10 | Growth targets are verified before production release | GJB 450 8.3 | ☐ | |
| Reviews | ||||
| 11 | Pre-test and post-test reviews are conducted | GJB 450 8.3 | ☐ | |
| 12 | Review records are retained | 7.5.3 | ☐ | |
| Documentation | ||||
| 13 | Test plans, results, and analysis reports are retained | 7.5.3 | ☐ | |
| 14 | FRACAS records and corrective action documentation are retained | 8.5.2 | ☐ | |
9. Common Audit Findings and How to Avoid Them
| Finding | Why It Happens | How to Avoid |
|---|---|---|
| "No reliability growth plan" | Growth not systematically planned | Document reliability growth plan with targets and test plans |
| "No TAAF process implemented" | Testing without analysis and corrective action | Implement complete TAAF cycle — test, analyze, fix, verify |
| "No FRACAS system" | Failures not systematically tracked | Establish FRACAS per GJB 841 |
| "Corrective actions not verified" | Actions implemented but effectiveness not confirmed | Verify corrective action effectiveness before closure |
| "No growth tracking" | Growth not monitored against targets | Track growth against model; update predictions |
| "No pre/post test reviews" | Reviews not conducted per GJB 450 | Conduct pre- and post-test reviews; document results |
| "Growth test not per GJB 1407" | Test not conducted to standard requirements | Conduct growth tests per GJB 1407 |
10. Frequently Asked Questions
What is reliability growth management under GJB 450?
Reliability growth management is the systematic process of improving product reliability through the TAAF (Test-Analyze-And-Fix) cycle. It is implemented through Work Item 403 (Reliability Growth Test) and the FRACAS system, with the goal of achieving specified reliability requirements through progressive design and process improvements.
What is the TAAF process?
TAAF stands for Test-Analyze-And-Fix — a systematic cycle of testing to expose failures, analyzing to determine root causes, and implementing fixes to prevent recurrence. It is the fundamental engine of reliability growth.
What is FRACAS and why is it important?
FRACAS (Failure Reporting and Corrective Action System) is a closed-loop system for reporting, analyzing, and correcting failures. It is essential for tracking failures throughout the reliability growth process and ensuring that corrective actions are implemented and verified.
What is the difference between reliability growth test and reliability qualification test?
Reliability growth test (Work Item 403) is conducted during development to identify and correct design deficiencies and improve reliability through the TAAF process. Reliability qualification test (Work Item 404) is conducted to verify that the final design meets specified reliability requirements.
What is the role of GJB 1407 in reliability growth?
GJB 1407 is the specific standard for reliability growth testing. It provides requirements for planning, conducting, and evaluating reliability growth tests. Reliability growth test is a work item of GJB 450 and the formal pathway for achieving reliability growth.
What are the three phases of reliability growth?
Reliability growth occurs across three lifecycle phases: development phase (initial prototypes to design maturity), pilot production phase (manufacturing process refinement), and production/field phase (process optimization and defect reduction).
What information sources drive reliability growth?
Reliability growth is driven by three information sources: empirical information (similar product experience, historical data), analytical information (FMECA, fault tree analysis, design reviews), and test information (growth test results, environmental test results).
How does reliability growth apply to PCB manufacturing?
For PCB manufacturing, reliability growth addresses design issues (impedance, thermal management), material issues (laminate selection, surface finish), process issues (soldering, plating, etching), and manufacturing defects. Through systematic TAAF cycles, PCB designs and processes are progressively improved to achieve required reliability levels.
Related Standards & Topics
PCB and PCBA Manufacturing for Military and Aerospace Programs
UltroNiu Electronics Group provides PCB and PCBA manufacturing services with GJB9001C-compliant reliability growth management and TAAF programs. Contact our engineering team for program-specific reliability growth requirements and compliance support.
Request Engineering ReviewReferences: GJB9001C-2017 Clause 8.1(g) (Central Military Commission Equipment Development Department); GJB 450-2008 Equipment Reliability Work General Requirements — Work Item 403 (Reliability Growth Test); GJB 1407-1992 Reliability Growth Test; GJB 841-1990 Failure Reporting, Analysis, and Corrective Action System. Reliability growth definition and TAAF process sourced from GJB 450 Work Item 403 and reliability engineering best practices. Growth test requirements sourced from GJB 1407-1992. FRACAS requirements sourced from GJB 841-1990. PCB-specific reliability growth practices based on industry best practices for military and aerospace PCB manufacturing. Courtesy of UltroNiu Engineering Knowledge Center.
Get Custom Quote
PRODUCTS CENTER
World-class PCB & PCBA manufacturer focused on high-frequency and high-reliability boards for defense, aerospace, automotive and industrial electronics.
You can unsubscribe at any time with a single click.
Copyright © 2025 UltroNiu Electronics Group All Rights reserved.
WhatsApp：8618823711371
Email：info@ultroniu.com
Message
Phone：+86 188 2371 1371
Tel：+86-0755-28788896