Advanced Manufacturing Equipment
Precision • Automation • Reliability
At UltroNiu, innovation meets precision. Our integrated factories bring together advanced PCB fabrication (HDI, flex & rigid-flex) and high-speed SMT under a unified digital system—delivering measurable accuracy, repeatability, and reliable throughput for prototypes and mass production alike.
Smart Factory Overview
Our manufacturing network integrates rigid, flex, and HDI PCB production lines with automated SMT assembly, all connected to a unified MES + ERP backbone. Real-time monitoring, process simulation, and SPC-driven analytics guarantee stable processes and repeatable excellence.
4 Production Bases
Shenzhen · Wuxi · Huizhou · Baoan
1,000+ Total Equipment Units
Fabrication, assembly, inspection, and utilities
250+ Core Precision Machines
LDI, laser drilling, presses, VCP/PTH, SMT, 3D SPI/AOI, reflow
Drilling Capacity
20 laser · 50 multi-spindle (150+ spindles)
Microvia Capability
50 µm vias · ±10 µm registration
Standards & Certifications
ISO 9001 · IATF 16949 · ISO 14001 · UL · ISO 13485 MIL-PRF-31032
Smart Manufacturing & Digital Factory
Data-driven precision, full-process traceability, and SPC-based quality control.
Non-Contact Production
Automated Logistics100%
Centralized Chemical Dispensing100%
Automatic Board Loading / Unloading87%
Full-Process Traceability
QR Code Traceability100%
Man-Machine-Material-Method-Environment Tracking100%
Defect E-Map Visualization100%
Intelligent Production
Simulation & Modeling100%
Automated Scheduling100%
Program Management100%
Smart Quality Control
Product SPC Control100%
Process SPC Control100%
Defect & Yield Monitoring System100%
Below is a representative list of the core PCB and PCBA equipment that powers this smart, traceable manufacturing ecosystem.
Rigid PCB Manufacturing Equipment
Our rigid PCB production lines integrate advanced laser imaging, microvia drilling, and automated copper plating systems—delivering precision and consistency for multilayer and HDI boards.
Automatic CCD Punching
CCD vision registration with ±10 µm alignment accuracy for multilayer lamination.
LDI Automatic Exposure
Laser Direct Imaging for ultra-fine circuits and tight inter-layer registration; ideal for HDI/high-frequency designs.
Mitsubishi Laser Drilling
HDI microvias down to 50 µm, positional accuracy ±10 µm for RF, fine-pitch, and aerospace boards.
Automatic Horizontal PTH Line
Uniform through-hole copper deposition with closed-loop control.
Vertical Continuous Plating (VCP) Line
Even copper thickness and stable throughput for HDI volume production.
DI Exposure Machine
Digital imaging exposure enables accurate pattern transfer and high yield without film distortion.
Automated Etching Line
Real-time chemistry control for precise trace width and consistent copper removal.
Vacuum Legend Printing Line
Clear, durable legends with strong adhesion and minimal contamination.
High-Precision CNC Milling
Micron-level routing, cavities, countersinks, and complex outlines.
Digital Inkjet Legend Printing
Digital inkjet printing offers fast, clean legends and barcodes with zero screen preparation.
Laser Marking System
Non-contact serialization and QR/2D IDs for full digital traceability.
Automated Final Sorting/Unloader
Optical sorting and barcode-based binning for traceable outbound quality.
Flexible & Rigid-Flex PCB Equipment
Our flexible and rigid-flex PCB production facilities feature advanced imaging, cutting, and bonding technologies that deliver durability, precision, and lightweight performance.
Plasma Cleaning
Surface activation improves interlayer adhesion and long-term reliability.
Laser Drilling Machine (MITSUBISHI)
Stable microvia formation in thin substrates for flexible HDI stack-ups.
VCP (Flex-Capable) Plating
Even copper build-up on flex/rigid-flex constructions with controlled parameters.
Orbotech LDI for Flex
High-precision imaging that maintains tight alignment under tension.
Vacuum Etching Line (DES)
Vacuum-assisted control for uniform copper removal and sharp edges.
Laser Cutting
Non-contact profile cutting with smooth, burr-free edges for flex and coverlay.
Automatic Stiffener Bonder
Automated placement/bonding of PI/FR-4 stiffeners for flatness and strength.
SMT Assembly Line
Our multi-brand SMT lines (Yamaha) integrate high-speed placement, inline 3D SPI/AOI, and controlled reflow to ensure precision and yield across prototypes and mass production.
Board Loader
Automated loading of bare boards for continuous throughput.
Laser Marking
Permanent QR/serial codes for complete traceability.
Stencil Printer
Precise solder paste deposition with tight thickness control.
Dispenser
Targeted adhesives/underfill for complex mixed assemblies.
3D Solder Paste Inspection (3D-SPI)
Micron-level height/volume monitoring to prevent pre-placement defects.
Pick & Place (Single-Track Yamaha)
Fast, accurate placement for small to medium batches.
Pick & Place (Dual-Track Yamaha)
Dual-lane throughput for continuous high-volume production.
Pre-Reflow AOI
Optical inspection before reflow to improve first-pass yield.
Reflow Oven
12-zone controlled thermal profiles for robust solder joints.
Board Unloader
Automated offloading to reduce handling and cycle time.
World-class PCB & PCBA manufacturer focused on high-frequency and high-reliability boards for defense, aerospace, automotive and industrial electronics.
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