Technology Roadmap
Our ongoing investments in equipment, processes and new PCB technologies.
PCB Technology & Capabilities
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Traditional PCB Advancements
Our traditional PCB capabilities continue to evolve, pushing the boundaries of layer count, line precision, and impedance control to meet the demands of increasingly complex electronic devices.
Traditional PCB - 1
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2020 Standard | 2020 Advanced | 2021 | 2022 | |
| Line Width/Space(um): | 50/50 | 40/40 | 40/40 | 35/35 | |
| Pattern Position Tolerance(um): | +/-30 | +/-25 | +/-25 | +/-20 | |
| Impedance Tolerance: | +/-8% | +/-5% | +/-5% | +/-4% | |
| Maximum Layer Count: (Traditional & HDI) | 26L | 30L | 30L | 36L | |
| Routing Tolerance: (um) | +/-75 | +/-50 | +/-50 | +/-35 | |
| Finished Board Thickness: (mm) | 0.2~3.5 | 0.15~4.0 | 0.15~4.0 | 0.1~4.0 | |
| Board Thickness Tolerance (mm) | Thickness > 0.5mm: | +/-10% | +/-8% | +/-8% | +/-6% |
| Thickness ≤ 0.5mm: | +/-0.05 | +/-0.03 | +/-0.03 | +/-0.03 | |
HDI Technology Roadmap
High-Density Interconnect technology represents the forefront of PCB miniaturization, enabling more functionality in smaller form factors through advanced microvia processes and sequential lamination.
HDI
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2020 Standard | 2020 Advanced | 2021 | 2022 |
| Maximum Layer count of Any-layer: | 14L | 16L | 16L | 18L |
| Minimum Blind via size(mm): | 0.075 | 0.075 | 0.075 | 0.075 |
| Max Blind Via Aspect Ratio: | 0.7:1 | 0.8:1 | 0.8:1 | 1:1 |
| Min Blind via Capture pad(mm): | Dia.+0.15 | Dia.+0.1 | Dia.+0.13 | Dia.+0.1 |
| Min Blind via Target Pad(mm): | Dia.+0.15 | Dia.+0.1 | Dia.+0.13 | Dia.+0.1 |
| Filling via dimple value(um): | ≤15 | ≤10 | ≤10 | ≤10 |
| Maximum lamination times: | 6 | 7 | 7 | 8 |
Rigid-Flex & Flexible PCB Evolution
Rigid-flex technology combines the best of both worlds—structural stability and flexible connectivity—opening new possibilities for innovative product designs in wearables, medical devices, and aerospace applications.
Rigid-flex1
| Item | Flex - Rigid | Regal | Semi-Flex |
| Figure |  |
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| Flexible Material | Polyimide | FR4 + Coverlay(Polyimide) | FR4 |
| Flexible thickness | 0.025~0.1mm (Exclude copper) |
0.05~0.1mm (Exclude copper) |
Remained Thickness: 0.25+/-0.05mm (Dedicated Material: EM825(I)) |
| Bending angle | Max 180° | Max 180° | Max 180° (Flex layer≤2) Max 90° (Flex layer>2) |
| Flexural Endurance IPC-TM-650,Method 2.4.3. | <1000 cycle | < 25 cycle | NA |
| Bending Test 1) Mandrel diam: 6.25mm |
<10K cycle (Bending Angle:180°) |
<500 cycle (Bending Angle:180°) |
<10 cycle (Bending Angle:180°) |
| Application | Flex to install &Dynamic(Single side) | Flex to install | Flex to install |
Rigid-flex2
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2020 Standard | 2020 Advanced | 2021 | 2022 |
| Line Width/Space on Flex Core(um): | 60/60 | 50/50 | 50/50 | 40/40 |
| Impedance Tolerance on Flex Layer: | +/-8% | +/-5% | +/-5% | +/-4% |
| Flex Core Thickness (Exclude copper) (um): | 25 | 25 | 20 | 12.5 |
| Maximum Flex Layer Count: | 6L | 8L | 8L | 8L |
| Flex outline tolerance(um): | +/-100 | +/-50 | +/-75 | +/-50 |
| Flex outline to Pattern tolerance (um): | ±100 | ±50 | ±75 | ±50 |
| Finished Flex Board Thickness (mm): | 0.075~0.25 | 0.075~0.3 | 0.075~0.3 | 0.075~0.3 |
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