Shengyi High-Speed & RF PCB Manufacturing
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Shengyi High-Frequency & High-Speed PCB Materials
UltroNiu provides engineering-driven PCB manufacturing based on Shengyi high-frequency and high-speed laminate systems, including PTFE, thermoset and ultra-low-loss materials for RF, microwave, mmWave and high-speed digital applications.
Our engineering team supports material selection, hybrid stackup optimization, controlled impedance and volume-production reliability for demanding RF and high-speed PCB projects.
Application-Based Material Selector
| Application | Recommended Material | Typical Frequency |
|---|---|---|
| 77GHz Automotive Radar | SJ9220 | mmWave |
| RF Power Amplifier | SJ9036 | 1–10GHz |
| AI Server / 112G PCB | SJ7032GN | 56G/112G PAM4 |
| Microwave Backhaul | SJ9350H | 6–40GHz |
| Satellite RF Systems | SJ9618 | Ku/Ka Band |
Why Engineers Use Shengyi Materials in Production PCB Builds
Material performance alone does not determine RF and high-speed PCB reliability. Manufacturing stability, stackup engineering and process control are equally critical for signal integrity and long-term production consistency.
UltroNiu supports Shengyi-based PCB projects with dedicated RF manufacturing workflows, impedance verification and hybrid stackup engineering for stable production performance.
Common Engineering Challenges
| Engineering Challenges | UltroNiu Engineering Controls |
|---|---|
| PTFE drilling smear and hole-wall reliability | Dedicated PTFE processing workflow |
| Hybrid stackup instability | Controlled impedance verification |
| Dk variation across production lots | RF coupon validation |
| Copper adhesion on PTFE laminates | Plasma surface treatment |
| Z-axis expansion mismatch | Hybrid stackup balancing |
| Impedance drift in multilayer RF PCB | Lamination process window control |
| Registration accuracy in high-layer-count boards | Thermal reliability verification |
| Resin flow imbalance during lamination | Lot-to-lot material inspection |
Shengyi PCB Materials by Application
Automotive Radar PCB
Low-loss PTFE for 24/77GHz radar antennas.
- SJ9220
- SJ9300H
- SJ9350H
AI Server & 112G PCB
Ultra-low-loss for PAM4 transmission.
- SJ7032GN
- SJ7036N
RF & Microwave PCB
For filters, couplers, feed networks.
- SJ9294
- SJ9036
- SJ9350
Satellite Communication PCB
Stable dielectric for Ku/Ka band.
- SJ9350H
- SJ9618
RF Hybrid PCB
PTFE + FR-4 hybrid stackups.
- SJ9036
- SJ930B
mmWave Antenna PCB
Ultra-low-loss for phased-array.
- SJ9220
- SJ9300H
Shengyi Material Engineering Matrix
| Application | Recommended Material | Dk | Df | Key Advantage | Manufacturing Notes |
|---|---|---|---|---|---|
| 77GHz Radar | SJ9220 | 2.2 | 0.0008 | Ultra-low loss | Tight impedance control |
| RF Hybrid PCB | SJ9294 | 2.94 | 0.0011 | Stable dielectric | Controlled lamination |
| AI Server / 112G | SJ7032GN | 3.34 | 0.0014 | Low insertion loss | Long-channel SI opt. |
| RF Amplifier | SJ9036 | 3.5 | 0.003 | Cost/performance balance | Hybrid stackup |
| Microwave Backhaul | SJ9350H | 3.55 | 0.002 | Thermal stability | Low phase drift |
Need Help Selecting a Material? Our engineering team can recommend suitable Shengyi laminates based on frequency range, insertion loss target, stackup structure and manufacturing requirements.
Shengyi Materials Compared with Rogers, Taconic & Megtron
Many RF and high-speed PCB projects evaluate Shengyi laminates alongside Rogers, Taconic and Megtron materials based on dielectric profile, thermal behavior and manufacturability.
| No. | Category | Shengyi Model | Equivalent Material | Resin / Filler System | Dk | Df |
|---|
Shengyi PCB Material Technical Specifications: Electrical, Thermal & Mechanical Properties
Complete Dk/Df, CTE, thermal conductivity, moisture absorption, peel strength, and density data for all Shengyi high-frequency and high-speed laminates. Use this table for stackup simulation, thermal analysis, and process qualification.
| No. | Category | Product | Product Structure | Dk | Dk Tol. | Df | TcDk | Volume Res. | Surface Res. | Moisture | λ (W/m·K) | CTE X | CTE Y | CTE Z | Peel (lbs/in) | Density |
|---|
RF & High-Speed PCB Manufacturing Capability
| Capability | Specification | Capability | Specification |
|---|---|---|---|
| Layer Count | 2–32 Layers | Min Trace/Space | 2/2 mil |
| Controlled Impedance | ±5% | PTFE PCB Processing | Supported |
| Hybrid Stackup | Supported | Back Drilling | Supported |
| Via Fence Structure | Supported | RF Coupon Validation | Available |
| VNA Testing | Available | Copper Weight | 0.5–4 oz |
FAQ About Shengyi PCB Manufacturing
Need engineering support for your Shengyi-based RF or high-speed PCB project?
Request Engineering Review →Get Custom Quote
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