Minimum Trace / Space
Fine line/space capability for dense layouts and compact form factors.
PCB Technology & Capabilities
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Minimum Trace / Space — Process Capabilities & DFM Guide
Finer trace/space increases routing density, shortens BGA escapes, and tightens impedance on thin dielectrics—critical for HDI and high-speed designs.
Process Capability Matrix（Finished Geometry）
|
Layer / Copper |
Standard |
Advanced |
Notes |
|
Outer, 12–18 µm (⅓–½ oz) |
2.0/2.0 mil |
1.4/1.4 mil |
LDI + tight SPC |
|
Outer, 35 µm (1 oz) |
2.5/2.5 mil |
2.0/2.0 mil |
More undercut → more comp. |
|
Inner, 18–35 µm |
2.5/2.5 mil |
2.0/2.0mil |
Registration & smear control |
|
Heavy copper 2–3 oz |
5.0/5.0–6.0/6.0 mil |
4.0/4.0 mil |
Deep-etch control |
|
Ultra heavy 4–10 oz |
8.0/8.0–12/12 mil |
— |
Per application |
Geometry & Etch Compensation（Designer-Ready）
- Etch compensation: Add +10–25% width (outer 1 oz typically +15–20%); confirm per copper & stack-up.
- Solder-mask dams: LPI ≥3 mil (75 µm); LDI mask on review ≈2.5 mil (65 µm).
- Copper balance: Use thieving/mesh; avoid large voids near fine lines.
- Annular ring: Finished ≥3–4 mil (outer), ≥2–3 mil (inner), drill-tolerance dependent.
BGA Fan-out Guidance
|
BGA Pitch |
Typical Escape |
Notes |
|
0.80 mm |
3/3 mil + dog-bone |
Standard FR-4 workable |
|
0.65 mm |
3/3 or 2.5/2.5 mil; VIP optional |
Prefer LDI |
|
0.50 mm |
VIP/VOP + 2.5/2.5 mil |
Any-layer HDI helpful |
|
0.40 mm |
VIP/VOP + 2.0/2.0 mil (or 1.4/1.4 on reviewed HDI) |
Stacked microvias likely |
Manufacturing Flow & Controls
LDI imaging → Fine-line dry film → Uniform pattern plating → Controlled SES etch → AOI (5–7 µm pixel) → Micro-repair rules → Mask registration → Finish.
Quality & Verification
Cross-section for finished width/space and profile; AOI database vs. CAM nominal; TDR sampling when fine-line routes carry HSD.
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