PCB Manufacturing & Advanced Board Fabrication
Boards built for real-world reliability, from FR-4 to RF/microwave.
UltroNiu manufactures PCBs in our own plants, from quick multilayer samples to stable series production. We cover standard FR-4, HDI, rigid-flex, high-speed and RF/microwave boards for automotive, defense, industrial, UAV and AI electronics.
High-Speed & High-Frequency PCB
Boards built for GHz signals, fast edges and tight loss budgets.
UltroNiu manufactures high-speed digital and RF/microwave PCBs using low-loss materials, controlled stack-ups and proven processes. From SerDes and backplanes to radar and RF front-ends, we help you turn sensitive designs into repeatable production boards.
High-Speed & High-Frequency PCBs
Low-loss materials, controlled structures and proven processes for RF, microwave and high-speed digital designs.
High-Speed PCB
Boards optimized for high-speed interfaces and backplanes with tight impedance and skew control.
Learn more
High-Frequency PCB
PCBs using low-loss materials and controlled stack-ups for GHz-level analog and RF signals
Learn more
Microwave PCB
Specialized designs for radar, microwave links and mmWave systems with strict loss and phase control.
Learn more
RF PCB
RF front-end and transceiver boards with tuned structures, grounding and shielding.
Learn more
Rogers PCB
PCBs built on Rogers and similar high-performance laminates for demanding RF and microwave applications.
Learn more
PCB Type
From everyday control boards to high-frequency and high-power PCBs.
Different projects need different boards. We build a full range of PCB types so your mechanical, thermal and layout requirements can all be handled in one place.
FR-4 Rigid PCB
Standard and high-Tg FR-4 rigid boards for control, industrial and general electronics.
Learn more
Rigid-Flex PCB
Combines rigid and flex areas in one board for lightweight, compact and vibration-resistant designs.
Learn more
HDI PCB
High-density boards with microvias, blind/buried vias and fine traces for compact, complex layouts.
Learn more
Heavy Copper PCB
Boards with thicker copper or metal cores for high-current, high-power and thermal-critical applications.
Learn more
Metal Core PCB
Boards with thicker copper or metal cores for high-current, high-power and thermal-critical applications.
Learn more
Multilayer PCB
4–N layer multilayer boards for more complex routing, power distribution and grounding structures.
Learn more
See real PCB examples and stack-ups
Explore our PCB Product Center for sample projects, typical stack-ups and application- specific designs across automotive, defense, industrial and UAV electronics.
View PCB Product CenterPCB Capabilities
PCB Capabilities & Technology
We publish and work within well-defined capability windows for layers, thickness, line/space, drills and tolerances. That makes it easier for your team to design boards that build right the first time.
PCB Manufacturing Capabilities
Key manufacturing limits and ranges, including layer counts, thickness, line/space, drill sizes and tolerance.
Learn more
Process Technology
Overview of special technologies such as HDI, rigid-flex, heavy copper, controlled impedance and more.
Learn more
Quality & Inspection Standards
Key manufacturing limits and ranges, including layer counts, thickness, line/space, drill sizes and tolerance.
Learn more
Technology Roadmap
Our ongoing investments in equipment, processes and new PCB technologies.
Learn more
PCB Materials
Supported FR-4 grades, high-frequency laminates, metal cores and specialty materials.
Learn more
PCB Process and Technology
PCB Process & Specialized Technologies
Beyond basic fabrication, we support a set of advanced processes that make the difference for high-speed, RF and power boards.
Resin Plugging & Via-in-Pad
Filled vias and via-in-pad structures for HDI, BGA breakout and better thermal paths.
Learn more
Step Drill / Controlled Depth Drilling
Multiple-diameter and depth-controlled holes for special mechanical and electrical needs.
Learn more
Castellated Hole / Half Hole
Edge-plated half holes for modules and board-to-board connections.
Learn more
PCB Buried & Blind Vias PCB
Advanced via structures to increase routing density and save space.
Learn more
Minimum Trace / Space
Fine line/space capability for dense layouts and compact form factors.
Learn more
Surface Finish Options
ENIG, ENEPIG, immersion tin/silver, OSP and hard gold to match assembly and reliability needs.
Learn more


