PCB Manufacturing

PCB Manufacturing & Advanced Board Fabrication

Boards built for real-world reliability, from FR-4 to RF/microwave.

UltroNiu manufactures PCBs in our own plants, from quick multilayer samples to stable series production. We cover standard FR-4, HDI, rigid-flex, high-speed and RF/microwave boards for automotive, defense, industrial, UAV and AI electronics.

High-Speed & High-Frequency PCB


Boards built for GHz signals, fast edges and tight loss budgets.

UltroNiu manufactures high-speed digital and RF/microwave PCBs using low-loss materials, controlled stack-ups and proven processes. From SerDes and backplanes to radar and RF front-ends, we help you turn sensitive designs into repeatable production boards.
High-Speed & High-Frequency PCB

High-Speed & High-Frequency PCBs

Low-loss materials, controlled structures and proven processes for RF, microwave and high-speed digital designs.

High-Speed PCB

Boards optimized for high-speed interfaces and backplanes with tight impedance and skew control.
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High-Frequency PCB

PCBs using low-loss materials and controlled stack-ups for GHz-level analog and RF signals
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Microwave PCB

Specialized designs for radar, microwave links and mmWave systems with strict loss and phase control.
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RF PCB

RF front-end and transceiver boards with tuned structures, grounding and shielding.
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Rogers PCB

PCBs built on Rogers and similar high-performance laminates for demanding RF and microwave applications.
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PCB Type


From everyday control boards to high-frequency and high-power PCBs.

Different projects need different boards. We build a full range of PCB types so your mechanical, thermal and layout requirements can all be handled in one place.
PCB Type

FR-4 Rigid PCB

Standard and high-Tg FR-4 rigid boards for control, industrial and general electronics.
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FPC

Thin, bendable circuits for space-constrained and moving connections.
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Rigid-Flex PCB

Combines rigid and flex areas in one board for lightweight, compact and vibration-resistant designs.
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HDI PCB

High-density boards with microvias, blind/buried vias and fine traces for compact, complex layouts.
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Special PCB

Special PCB Manufacturing for Thermal, High-Voltage & Integrated Structures
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Heavy Copper PCB

Boards with thicker copper or metal cores for high-current, high-power and thermal-critical applications.
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Metal Core PCB

Boards with thicker copper or metal cores for high-current, high-power and thermal-critical applications.
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Multilayer PCB

4–N layer multilayer boards for more complex routing, power distribution and grounding structures.
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See real PCB examples and stack-ups

Explore our PCB Product Center for sample projects, typical stack-ups and application- specific designs across automotive, defense, industrial and UAV electronics.

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PCB Capabilities


PCB Capabilities & Technology

We publish and work within well-defined capability windows for layers, thickness, line/space, drills and tolerances. That makes it easier for your team to design boards that build right the first time.
PCB Capabilities

PCB Manufacturing Capabilities

Key manufacturing limits and ranges, including layer counts, thickness, line/space, drill sizes and tolerance.
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Process Technology

Overview of special technologies such as HDI, rigid-flex, heavy copper, controlled impedance and more.
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Quality & Inspection Standards

Key manufacturing limits and ranges, including layer counts, thickness, line/space, drill sizes and tolerance.
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Technology Roadmap

Our ongoing investments in equipment, processes and new PCB technologies.
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PCB Materials

Supported FR-4 grades, high-frequency laminates, metal cores and specialty materials.
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PCB Process and Technology


PCB Process & Specialized Technologies

Beyond basic fabrication, we support a set of advanced processes that make the difference for high-speed, RF and power boards.
PCB Process and Technology

Resin Plugging & Via-in-Pad

Filled vias and via-in-pad structures for HDI, BGA breakout and better thermal paths.
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Step Drill / Controlled Depth Drilling

Multiple-diameter and depth-controlled holes for special mechanical and electrical needs.
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Castellated Hole / Half Hole

Edge-plated half holes for modules and board-to-board connections.
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PCB Buried & Blind Vias PCB

Advanced via structures to increase routing density and save space.
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Edge Plating

Plated board edges for shielding, grounding or mechanical strength.
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Controlled Impedance

Controlled impedance structures for high-speed and RF signals.
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Minimum Trace / Space

Fine line/space capability for dense layouts and compact form factors.
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Surface Finish Options

ENIG, ENEPIG, immersion tin/silver, OSP and hard gold to match assembly and reliability needs.
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