PCB Assembly Capabilities

SMT assembly capacity: 19 million points/day

Testing Equipment

X-RAY Nondestructive Tester, First Piece Tester, AOI Automatic Optical Tester, ICT Tester, BGA Rework Station

Placement speed

Chip placement speed (at best conditions) 0.036 S/piece

Mounted Component Specifications

Pasteable smallest package

Minimum device accuracy

IC type chip accuracy

Mounted PCB Specifications

Substrate size

Substrate thickness

throw rate

1. Resistance-capacitance ratio 0.3%

2. IC type without throwing material

Board Type

POP/common board/FPC/rigid-flex board/metal substrate

DIP daily production capacity

DIP plug-in production line

50000 points/day

DIP post welding production line

20000 points/day

DIP test production line

50000 pcs PCBA/day

PCB Assembly processing capability

The company has more than 10 advanced assembly production lines, dust-free and anti-static air-conditioning workshop, TP dust-free workshop, equipped with aging room, test room, functional test isolation room, advanced and perfect equipment, can carry out various product assembly, packaging, testing, Aging, etc. production. Monthly production capacity can reach 150,000 to 300,000 sets/month

PCBA processing capability

project

Mass processing capability

Small batch processing capability

Number of layers (max)

2-68

20-128

Plate type

FR-4, Ceramic Sheet, Aluminum Base Sheet PTFE, Halogen Free Sheet, High Tg Sheet

PTFE, PPO, PPE

Rogers,etc Teflon

E-65, ect

Sheet mixing

4 layers - 6 layers

6th floor - 8th floor

biggest size

610mm X 1100mm

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Dimensional Accuracy

±0.13mm

±0.10mm

Plate thickness range

0.2mm--6.00mm

0.2mm--8.00mm

Thickness tolerance ( t≥0.8mm)

±8%

±5%

Thickness tolerance (t＜0.8mm)

±10%

±8%

Media thickness

0.076mm--6.00mm

0.076mm--0.100mm

Minimum line width

0.10mm

0.075mm

Minimum spacing

0.10mm

0.075mm

Outer copper thickness

8.75um--175um

8.75um--280um

Inner layer copper thickness

17.5um--175um

0.15mm--0.25mm

Drilling hole diameter (mechanical drill)

0.25mm--6.00mm

0.15mm--0.25mm

Hole diameter (mechanical drill)

0.20mm--6.00mm

0.10mm--0.20mm

Hole Tolerance (Mechanical Drill)

0.05mm

/

Hole tolerance (mechanical drill)

0.075mm

0.050mm

Laser Drilling Aperture

0.10mm

0.075mm

Plate thickness aperture ratio

10:1

12:1

Solder mask type

Photosensitive green, yellow, black, purple, blue, ink

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Minimum Solder Mask Bridge Width

0.10mm

0.075mm

Minimum Solder Mask Isolation Ring

0.05mm

0.025mm

Plug hole diameter

0.25mm--0.60mm

0.60mm-0.80mm

Impedance tolerance

±10%

±5%

Surface treatment type

Hot air leveling, chemical nickel gold, immersion silver, electroplated nickel gold, chemical immersion tin, gold finger card board

Immersion Tin, OSP

SMT main equipment process capability

machine

scope

Process parameters

Printing press  GKG GLS

PCB printing seal

50X50MM~610x510mm

Printing accuracy

±0.018mm

Frame size

420×520mm—737×737mm

PCB  thickness range

0.4-6mm

All-in-one machine for stacking board

PCB conveying seal

50X50MM~400x360mm

Unwinding machine

PCB conveying seal

50X50MM~400x360mm

YAMAHA YSM20R

When transferring 1 board

L50×W50mm ～L810×W490mm

SMD theoretical speed

95,000CPH ( 0.027sec / CHIP )

Mounting range

0201(mm)-45*45mm component mounting height: less than 15mm

Mounting accuracy

CHIP±0.035mm  ( ±0.025mm )  Cpk ≧ 1.0  ( 3σ )

number of components

140 kinds ( 8mm reel)

YAMAHA YS24

When transferring 1 board

L50×W50mm ～L700×W460mm

SMD theoretical speed

72,000CPH ( 0.05sec / CHIP )

Mounting range

0201(mm)-32*mm component mounting height: 6.5MM

Mounting accuracy

±0.05mm(μ+3σ) 、±0.03mm(3σ)

number of components

120 kinds ( 8mm reel)

YAMAHA YSM10

When transferring 1 board

L50×W50mm ～L510×W460mm

SMD theoretical speed

46000CPH ( 0.078sec / CHIP )

Mounting range

0201(mm)-45*mm component mounting height: 15MM

Mounting accuracy

±0.035mm (±0.025mm) Cpk ≧ 1.0 (3σ)

number of components

48 types ( 8mm reel) / 15 automatic IC trays

JT TEA--1000

Adjustable for each dual track

W50~270MM substrate / single track adjustable W50*W450mm

The height of components on the PCB board

25MM up and down

conveyor belt speed

300~2000MM/MIN

ALeader ALD7727D AOI Online

Resolution / Visual Range / Speed

Optional: 7µm/Pixel FOV: 28.62mm x 21.00mm     Standard: 15µm/Pixel FOV: 61.44mm x 45.00mm

Detection speed

＜230ms/FOV

barcode system

Automatic barcode recognition ( 1D or 2D code )

PCB size range

50×50mm(Min) ～510×300mm(Max)

1 track fixed

1 track is fixed, 2 , 3 , 4 tracks can be adjusted, the minimum size between 2 and 3 tracks is 95mm , and the maximum size of 1 , 4 tracks is 700mm ;

single track

The maximum width of the track is 550mm ; for double tracks: the maximum width of both tracks is 300mm (testable width);

PCB thickness range

0.2MM ~ 5mm 

PCB top and bottom clearance

Top Side of PCB : 30 mm Bottom Side of PCB : 60 mm

SPI  Stech

barcode system

Automatic barcode recognition ( 1D or 2D code )

PCB size range

50×50mm(Min) ～630×590mm(Max)

precision

1µm, Height : 0.37µm

Repeatability

Less than 1µm (4sigma)     Volume / Area : Less than 1% (4sigma)   Height : Greater than 1µm (4sigma)

FOV speed

0.3s/FOV

Reference point detection time

0.5sec/pcs

Maximum detection height

±550µm~1200µm

Bending PCB Maximum Measurement Height

±3.5MM~±5MM

Minimum pad pitch

100µm ( based on a pad with a pad height of 1500µm )

Minimum measurement size

Rectangle 150µm, Round 200µm

Component height on PCB

40MM up and down

PCB board thickness

0.4~7MM

Shansi XRAY inspection equipment VX1800

Light tube voltage

130V-160KV

light tube current

0.15mA

System magnification

130 kV: 1500X 160 kV: 6000X

Closed tube function

Closed tube optional 90KV and 130KV, high power penetration shielding layer effect is better, detection of samples below 1 micron

Can detect samples at 70 degree angle

System magnification up to 6000

Light pipe focus size

1um-3um

Stage

650mmX540mm

geometric magnification

300 times

BGA detection

The magnification is larger, the image is clearer, and it is easier to see BGA virtual soldering and tin cracks

Stage

X , Y , Z direction positioning can be carried out ; X- ray tube and X- ray detector direction positioning