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PCB Buried & Blind Vias PCB

PCB Buried & Blind Vias PCB

Advanced via structures to increase routing density and save space.

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HDI (High-Density Interconnect) Technology

Achieve maximum functionality in minimal space. Our HDI capabilities utilize micro-laser vias to create incredibly dense and reliable interconnections, enabling smaller, lighter, and higher-performing devices.

Technology Product Categories Product Categories Min. Laser Vias Size Max. Lamination Cycles Max. Layers Laser Filled Via
Laser Via Anylayer 0.075mm 6~7 14~16 layers Y
Laser Via VOP
(Via On Capping)		 0.075mm 6+N+6 20~26 layers Y
Laser Via Skip Via 0.2mm 6~7 20~26 layers N

 

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World-class PCB & PCBA manufacturer focused on high-frequency and high-reliability boards for defense, aerospace, automotive and industrial electronics.

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Shenzhen, China

RoHS Compliant PCB Manufacturing and Assembly
ISO 14001:2015 Environmental Management System Certified
ISO 13485:2016 Medical Device Quality Management Certification
Member of IPC - Association Connecting Electronics Industries
REACH Compliant Electronic Components and PCB
GJB9001C-2017 Military Standard Quality Management System
AS9100D Aerospace and Defense Quality Management Certified
IATF 16949:2016 Automotive Quality Management System
UL Certified Printed Circuit Board Manufacturer
ISO 9001:2015 Quality Management System Certified

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