R&D & Engineering Center
Turning Complex Designs into Reliable Products
Our R&D and Engineering Center is the core engine of our technology-driven strategy. Here, your most complex PCB/PCBA concepts are translated into manufacturable, stable, and scalable products. With a team of over 200 engineers, we turn demanding ideas into high-reliability reality.
A Full-Chain Engineering Team of 200+ Experts
Our interdisciplinary team spans the entire PCB/PCBA value chain, ensuring deep specialization at every stage—from material selection and stack-up definition to process development and reliability validation.
Smart Engineering Front-End (EFX) Capabilities
Our EFX-based engineering front-end connects customer design data with factory processes, ensuring that complex boards are manufacturable, stable, and repeatable at scale.
Fast Data Review & Manufacturability Analysis (DFM)
Supports all mainstream formats: Gerber, ODB++, IPC-2581
Automatic detection of shorts, opens, acid traps, minimum trace/space violations
Aware of RF/microwave-specific structures such as antenna curves, metal backplanes, and impedance-controlled windows
Provides clear manufacturability recommendations and process risk alerts
Value: reduces rework, improves first-pass yield, and accelerates engineering response.
Intelligent Stack-Up Design
Supports full material portfolios: Rogers, Taconic, Isola, Shengyi, Panasonic, DuPont PTFE
Automatically matches Dk/Df and models impedance shifts caused by copper thickness changes
Automatic verification for HDI sequential lamination (1+N+1 / 2+N+2 / AnyLayer)
Current-carrying and thermal-path optimization for heavy-copper boards (3 oz–10 oz)
Value: delivers production-ready stack-ups instead of purely theoretical designs.
Impedance & High-Speed Signal Simulation (SI Front-End)
Supports differential, single-ended, back-drilled structures and multi-mode transmission models
HF/RF line models including microstrip, stripline, CPW and GCPW
Impedance control capability within ±5% for critical nets
Backdrill stub optimization and high-frequency loss prediction
Value: enables first-pass success for high-speed and RF projects—no black-box behavior, fewer iterations.
Automated CAM (CAM Automation)
Auto-recognition of layers, pad types, blind/buried vias and solder-mask openings
Normalizes incoming files to internal CAM and engineering standards
Auto-generated etch compensation, copper balancing, and routing/V-cut offset corrections
Multi-job panelization with automatic tolerance alignment, improving material utilization by ~3–8%
Value: speeds up CAM release and stabilizes yield for prototype-to-volume builds—fewer manual edits, faster NPI.
RF & HDI Engineering Toolkits
uHF module: optimizes antenna routing, length matching and impedance geometries
Validates key constraints for PTFE / LCP hybrid stack-ups
uHDI module: checks microvia stacking strategies and sequential lamination reliability
Rule validation for resin-plugged & copper-filled vias, plus heavy-copper + HDI high-density power optimization
Value:Cuts RF & HDI engineering risk early—higher first-pass yield, fewer re-spins, and stable performance from prototype to volume.
Electrical Test Front-End (ET-Front)
Automatic generation of NETLIST for electrical test
Reliability analysis for microvia and stacked-via structures
Intelligent optimization of test-point layout and access
Fully automated review of open, short and high-resistance defects
Value:Improves test coverage and defect capture for dense interconnects, reducing escapes without slowing test throughput.
PCBA Front-End Engineering
Component recognition and placement-coordinate / BOM output for SMT lines
Orientation and polarity verification for all critical components
BGA/LGA soldering simulation, including stencil thickness and aperture optimization
Automatic generation of SMT line process documentation (SOP)
Value: establishes a complete engineering workflow from PCB → PCBA → testing → shipment under one integrated system.
MES & Equipment Front-End Integration
Full digital data flow from CAM → MES → ERP
Integrated data interfaces for laser plotters, LDI, AOI, X-Ray and automatic electrical testers
Ensures consistency between engineering versions, process parameters and manufacturing tolerances
Compatible with major German and Japanese equipment platforms used in high-end PCB fabrication
Value:Ensures data consistency from engineering to shop floor, enabling repeatable builds and smoother volume ramp-up.
Our Engineering-Driven R&D Framework
From technology strategy to shop-floor implementation, we operate a closed-loop, engineering-led R&D model— ensuring every innovation becomes manufacturable, verifiable, and reliable capability.
Strategic Focus
Platform Development
Cross-Functional Teams
Project-Driven Breakthroughs
Our R&D Strength
Sustained investment and deep engineering expertise ensure your project is built on a foundation of reusable, scalable, and thoroughly validated technologies.
R&D and engineering personnel
core engineers with over 10 years of industry experience
R&D and engineering personnel
granted patents and software copyrights
High-Speed & High-Frequency PCB
PCB
Core Fabrication Technologies
PCBA
Core Assembly & Test
Advanced
Frontier Technologies
World-class PCB & PCBA manufacturer focused on high-frequency and high-reliability boards for defense, aerospace, automotive and industrial electronics.
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