PCB Manufacturing Capabilities
Key manufacturing limits and ranges, including layer counts, thickness, line/space, drill sizes and tolerance.
PCB Technology & Capabilities
PRODUCTS CENTER
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PRODUCTS CENTER
Scalable, Precision PCB Manufacturing Capacity
Powered by multiple state-of-the-art facilities in China, we deliver from quick-turn prototypes to high-volume production with consistent quality and advanced technological support.
Our Manufacturing Strength
| 2,850,000+ Monthly Capacity (sq. ft.) |
128 Maximum Layers |
0.0125/0.0125 Minimum Line Width/Line Spacing (mm) |
0.05 Minimum Laser Drilling (mm) |
Detailed Technical Specifications Across Our Facilities
Strategically utilize our different plants to best match your project's requirements for technology, cost, and lead time.
|
Capability |
Current |
Future |
|||
|
WU XI PCB Factory |
HUI ZHOU PCB Factory |
WU XI PCB Factory |
HUI ZHOU PCB Factory |
||
|
Plant Capacity(Kilo SF/Month) |
850K |
1200K |
900K |
1500K |
|
|
Layer Count (Layer) |
2 ~ 128 |
2 ~ 68 |
138 |
68 |
|
|
Line Width/Spacing(mm) |
0.0125/0.0125 |
0.05/0.05 |
0.0125/0.0125 |
0.04/0.04 |
|
|
Drill Size (mm) |
|||||
|
Mechanical size Min(mm) |
0.1 |
0.1 |
0.075 |
0.075 |
|
|
Laser size (mm) |
0.05 |
0.05 |
0.05 |
0.05 |
|
|
Electrical Test Pitch(mm) |
0.2 |
0.2 |
0.2 |
0.2 |
|
|
Board thickness (mm) |
|||||
|
Min |
2L |
0.15 |
0.15 |
0.1 |
0.1 |
|
Thickness |
4L |
0.25 |
0.25 |
0.2 |
0.2 |
|
Board Finishing |
|||||
|
OSP |
● |
● |
● |
● |
|
|
ENIG |
● |
● |
● |
● |
|
|
Selective ENIG |
● |
● |
● |
● |
|
|
ENEPIG |
● |
● |
● |
● |
|
|
Hard gold |
● |
● |
● |
● |
|
|
Soft gold |
● |
● |
● |
● |
|
|
Immersion Tin |
● |
● |
● |
● |
|
|
Immersion silver |
● |
● |
● |
● |
|
|
HASL & Lead |
Sub-contract |
Sub-contract |
Sub-contract |
Sub-contract |
|
|
Material |
|||||
|
FR4 |
● |
● |
● |
● |
|
|
(Leed-Free / Halogen-Free / Middle-Tg / High-Tg） |
|||||
|
BT |
● |
● |
● |
● |
|
|
High Speed & High Frequency |
● |
● |
● |
● |
|
|
High Thermal Conductive / IMS |
○ |
○ |
○ |
○ |
|
|
Polymide |
● |
● |
● |
● |
|
|
EMI |
● |
● |
● |
● |
|
|
Special Process/Product |
|||||
|
HDI |
● |
● |
● |
● |
|
|
Rigid-Flex |
● |
● |
● |
● |
|
|
Semi-Flex |
○ |
○ |
○ |
○ |
|
|
Heavy Copper |
● |
○ |
● |
○ |
|
|
Back Drill |
● |
● |
● |
● |
|
|
High Speed / High Frequency |
● |
● |
● |
● |
|
|
High Layer Count |
● |
○ |
● |
○ |
|
|
LED/ CMOS |
● |
● |
● |
● |
|
|
High Thermal Conductive |
● |
○ |
● |
○ |
|
|
Copper Inlay |
● |
○ |
● |
● |
|
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PRODUCTS CENTER
World-class PCB & PCBA manufacturer focused on high-frequency and high-reliability boards for defense, aerospace, automotive and industrial electronics.
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