PCB & PCBA Frequently Asked Questions
A centralized engineering knowledge base addressing common questions across PCB manufacturing, PCBA assembly, materials, processes, and reliability-driven design decisions.
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Advanced PCB Assembly & Production
What is the maximum layer count supported for rigid and HDI PCBAs?
We support up to 40 layers for advanced rigid boards and up to 20 layers for HDI builds, depending on material stack-up, copper weight, and design constraints.
Sequential lamination allows multiple stacked microvia layers, enabling highly complex interconnect architectures for miniaturized designs.
What design considerations are critical for HDI PCB assembly?
Key HDI design parameters include:
• Controlled impedance routing for signal integrity
• Minimum trace/space (down to 3/3 mil or 75µm)
• Microvia aspect ratio ≤ 1:1 for structural reliability
• Proper via-in-pad planning and copper wrap
• Balanced stack-up and symmetrical copper distribution
• Thermal management for high-speed or power-dense systems
Our DFM engineers provide early-stage feedback to prevent manufacturability and yield issues.
How do you control quality during HDI PCBA production?
Each board undergoes:
• Automated Optical Inspection (AOI) for trace and component alignment
• X-ray inspection for hidden BGA and via structures
• In-circuit (ICT) and functional testing (FCT) for performance verification
• Cross-section analysis for internal layer accuracy
• Full traceability of components and process parameters under ISO and IPC standards
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