Overview
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| Capability Area | Manufacturing Capability | Engineering & Reliability Support |
|---|---|---|
| Layer Count | Up to 128 layers for prototype and engineering builds; production-qualified up to 68 layers | Rogers and Rogers + FR-4 high-layer constructions depend on the material system, lamination cycles, registration, finished thickness and project review. |
| Rogers Material Systems | RO4000®, RO3000®, RO5000™, RT/duroid®, TMM® and selected Rogers bonding materials | Material grade, laminate thickness, copper cladding, bonding system and availability are confirmed before production. |
| Frequency Range | Sub-GHz to tens of GHz, including application-specific Ku/Ka-band projects | Material, stack-up, copper profile, transmission-line structure and validation method are selected for the target frequency. |
| Hybrid Lamination | Rogers laminate + high-Tg FR-4 mixed-dielectric multilayer stack-ups | Material compatibility, resin flow, lamination cycles, registration, CTE behavior and dimensional stability are reviewed. |
| Rogers Core Thickness | Common Rogers core thicknesses from approximately 0.127 mm to 3.18 mm | Available thickness depends on the Rogers material family, copper cladding and current material availability. |
| Transmission-Line Structures | Microstrip, stripline, CPW and GCPW | Trace geometry, dielectric construction, reference-plane continuity and return-path behavior are reviewed against the target impedance. |
| Line / Space | 50/50 µm production reference; down to 35/35 µm (1.4/1.4 mil) in qualified RF/HDI feature areas | Minimum features depend on the Rogers material, copper thickness, copper profile, finished board thickness, feature area and yield review. |
| Drill & Via Structures | Mechanical drill down to 0.10 mm; laser microvia down to 0.05 mm; blind/buried vias, via-in-pad and back-drilling | Minimum drill values are platform limits. Rogers and PTFE structures require stack-up, aspect-ratio, plating and reliability review. |
| Controlled Impedance | 50 Ω, 75 Ω, differential and custom targets; ±5% production capability and down to ±2% for special builds | Tighter tolerances require approved stack-up parameters, controlled material data, etching compensation, impedance coupons and TDR verification. |
| Layer Registration | ±50 µm standard; down to ±25 µm for qualified HDI constructions | Registration capability depends on layer count, panel dimensions, lamination cycles, material movement and imaging process. |
| Copper Profile | ED, VLP and HVLP copper; HVLP below 0.6 µm Ra available for selected RF constructions | Copper profile is selected according to conductor loss, adhesion, etching capability, frequency and cost requirements. |
| PCB Thickness | 0.1–8.0 mm RF manufacturing platform range | Finished thickness depends on the Rogers material system, layer count, copper weight, hybrid construction and mechanical requirements. |
| Copper Thickness | 1/3 oz to 4 oz | Copper distribution is reviewed against impedance, conductor loss, thermal performance, line width and plating requirements. |
| Back-Drill Stub Control | Residual stub target ≤150 µm; ≤250 µm typical production reference | Stop layers, drill diameter, depth tolerance and residual-stub acceptance criteria are defined before fabrication. |
| Special RF Structures | Via fences, edge plating, cavities, metal-backed boards and RF connector-launch structures | Ground continuity, transition geometry, cavity dimensions, mechanical tolerances and assembly interfaces are reviewed before production. |
| Surface Finishes | ENIG, ENEPIG, immersion silver, immersion tin, OSP and selective hard gold | Finish selection considers RF loss, pad geometry, connector interfaces, assembly process, wire bonding and reliability requirements. |
| Verification & Test | AOI, electrical test, TDR, impedance coupons, microsection, Dk/Df lot review and project-defined S-parameter testing | Test methods, coupon structures, sample quantities, reporting requirements and acceptance criteria are agreed before fabrication. |
| Production Support | Prototype, engineering sample, NPI and volume production | Approved materials, stack-up parameters, fabrication requirements and inspection records support repeat-production consistency. |
| Quality Standards | ISO 9001, IATF 16949, GJB9001C and AS9100D quality systems | IPC Class 3/3A and other project-specific requirements are supported when defined in the approved manufacturing documentation. |
The values above represent platform maximums, production references or qualified process limits and may not be achievable simultaneously in a single Rogers PCB construction. Final capability depends on the selected Rogers material, copper thickness, board dimensions, stack-up, layer count, via structure and project-specific acceptance criteria.
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