RF PCB Manufacturing Capability
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| Capability Area | Manufacturing Capability | Engineering & Reliability Support |
|---|---|---|
| Layer Count | 2–128 Layers | High-layer hybrid and sequential lamination |
| Material Systems | Rogers, PTFE, Ceramic-Filled Hydrocarbon, Low-Loss FR-4 | Material selection by Dk, Df, loss and thermal target |
| Hybrid Lamination | RF Laminate + FR-4 Hybrid Stackups | CTE, resin-flow and registration control |
| RF Transmission Structures | Microstrip, Stripline, CPW, GCPW | Return-path and field-containment review |
| Controlled Impedance | 50Ω, 75Ω, Differential and Custom Impedance | ±5% tolerance and TDR coupon verification |
| Phase Matching | Customer-Defined Electrical-Length Matching | Phase consistency and channel-matching review |
| Grounding & Via Fence | Via Stitching, Via Fences and Grounded Structures | Ground continuity and return-path control |
| Connector Launch | Edge-Launch and Board-Mount RF Connector Structures | Launch geometry and ground-transition review |
| Line / Space | 1.4 mil / 1.4 mil | Impedance-sensitive etching compensation |
| Via Structures | 75µm Microvia, Blind/Buried Via, Via-in-Pad, Backdrilling | Via-stub and RF transition review |
| Copper Profile | ED, VLP and HVLP Copper | Copper roughness and conductor-loss control |
| PCB Thickness | 0.1–8.0 mm | Controlled dielectric and finished thickness |
| Copper Thickness | 1/3 oz to 4 oz | Copper balance and thermal review |
| Surface Finishes | ENIG, ENEPIG, OSP, ImmAg, ImmSn | Finish selection by RF and assembly requirement |
| RF Verification & Test | TDR, S-Parameter, Impedance Coupon, Microsection | Project-specific test reports |
| RF Assembly Support | SMT, Through-Hole, RF Connectors and Shielding | Grounding, soldering and thermal DFM review |
| Quality Standards | ISO 9001, IATF 16949, GJB9001C, AS9100D | IPC Class 3 / 3A build requirements |
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