RF PCB Manufacturing Capability

RF PCB Manufacturing Capability

Capability Area Manufacturing Capability Engineering & Reliability Support
Layer Count 2–128 Layers High-layer hybrid and sequential lamination
Material Systems Rogers, PTFE, Ceramic-Filled Hydrocarbon, Low-Loss FR-4 Material selection by Dk, Df, loss and thermal target
Hybrid Lamination RF Laminate + FR-4 Hybrid Stackups CTE, resin-flow and registration control
RF Transmission Structures Microstrip, Stripline, CPW, GCPW Return-path and field-containment review
Controlled Impedance 50Ω, 75Ω, Differential and Custom Impedance ±5% tolerance and TDR coupon verification
Phase Matching Customer-Defined Electrical-Length Matching Phase consistency and channel-matching review
Grounding & Via Fence Via Stitching, Via Fences and Grounded Structures Ground continuity and return-path control
Connector Launch Edge-Launch and Board-Mount RF Connector Structures Launch geometry and ground-transition review
Line / Space 1.4 mil / 1.4 mil Impedance-sensitive etching compensation
Via Structures 75µm Microvia, Blind/Buried Via, Via-in-Pad, Backdrilling Via-stub and RF transition review
Copper Profile ED, VLP and HVLP Copper Copper roughness and conductor-loss control
PCB Thickness 0.1–8.0 mm Controlled dielectric and finished thickness
Copper Thickness 1/3 oz to 4 oz Copper balance and thermal review
Surface Finishes ENIG, ENEPIG, OSP, ImmAg, ImmSn Finish selection by RF and assembly requirement
RF Verification & Test TDR, S-Parameter, Impedance Coupon, Microsection Project-specific test reports
RF Assembly Support SMT, Through-Hole, RF Connectors and Shielding Grounding, soldering and thermal DFM review
Quality Standards ISO 9001, IATF 16949, GJB9001C, AS9100D IPC Class 3 / 3A build requirements

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