Overview(Microwave PCB)
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| Capability Area | Manufacturing Capability | Engineering & Validation Support |
|---|---|---|
| Layer Count | Up to 128 Layers | Construction based on laminate system and project review |
| Microwave Material Systems | Rogers, PTFE, ceramic-filled hydrocarbon, Megtron, high-Tg FR-4 | Selection by frequency, loss, Dk/Df and reliability targets |
| Hybrid Lamination | Microwave laminate + FR-4 / high-Tg multilayer | Material compatibility, resin flow and registration review |
| Material Dk/Df & Dielectric Control | Approved material specifications and controlled dielectric thickness | Material-lot documentation and stackup parameter review |
| Transmission-Line Structures | Microstrip, stripline, CPW, GCPW | Return-path, coupling and transition-structure review |
| Minimum Line / Space | Down to 1.4 / 1.4 mil | Based on material, copper thickness and finished board construction |
| Via & Transition Structures | PTH, blind/buried, via-in-pad, resin-filled vias, backdrill, edge plating | Via-stub, launch and return-path discontinuity review |
| Controlled Impedance | Project-defined targets, tolerance down to ±5% | Approved stackup, impedance coupons and TDR verification |
| Phase-Matched Channels | Project-defined phase and electrical-length requirements | Material stability, symmetry and finished-geometry review |
| Special Microwave Structures | Cavities, edge plating, antenna feeds, coupler and divider structures | Dimensional, isolation and manufacturability review |
| Copper Profile | ED, VLP and HVLP copper options | Selection by conductor-loss and adhesion requirements |
| PCB Thickness | 0.1–8.0 mm | Based on layer count, laminate system and construction |
| Copper Thickness | 1/3 oz–4 oz | Reviewed against loss, impedance and thermal requirements |
| Surface Finishes | ENIG, ENEPIG, OSP, ImmAg, ImmSn | Selection by microwave, assembly and reliability requirements |
| Verification & Test | Electrical test, TDR, dimensional inspection, microsection | Project-defined S-parameter or insertion-loss verification when specified |
| Quality Standards | ISO 9001, IATF 16949, GJB9001C, AS9100D | IPC-6012 Class 3 / 3A support for applicable projects |
Capability limits depend on the selected microwave laminate system, copper thickness, finished board thickness, transmission-line structure and project-specific engineering review. Request a Microwave Stackup & DFM Review →
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