Capability Overview
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| Capability Area | Manufacturing Capability | Engineering & Reliability Support |
|---|---|---|
| Layer Count | Up to 128 Layers | Available construction depends on the material system, hybrid structure and project review. |
| Material Systems | Rogers, PTFE, Ceramic-Filled Hydrocarbon, Megtron, High-Tg FR-4 | Material selection based on frequency, loss budget, Dk/Df, thermal behavior and reliability targets. |
| Hybrid Lamination | High-frequency laminate + FR-4 mixed-dielectric multilayer builds | Material compatibility, resin flow, lamination cycles, registration and dimensional stability review. |
| Material Dk/Df Review & Dielectric Control | Project-defined dielectric thickness control using approved material specifications | Material-lot documentation, stackup parameters and project-defined material requirements |
| Transmission-Line Structures | Microstrip, Stripline, CPW, GCPW | Return-path continuity, signal transitions and critical-geometry review. |
| Line / Space | Down to 1.4 mil / 1.4 mil | Capability depends on material type, copper thickness, finished board thickness and project review. |
| Via Structures | 75µm Microvia, Blind/Buried Via, Via-in-Pad, Backdrilling | Via-transition, stub and microsection review according to project requirements. |
| Impedance Control | Project-defined targets with tolerance down to ±5% | Impedance coupons, approved stackup parameters and TDR verification. |
| Copper Profile | ED, VLP and HVLP Copper options | Copper-profile selection according to conductor-loss and manufacturability requirements. |
| PCB Thickness | 0.1–8.0 mm | Thickness capability depends on layer count, material system and construction. |
| Copper Thickness | 1/3 oz to 4 oz | Copper distribution reviewed against impedance, thermal and fabrication requirements. |
| Surface Finishes | ENIG, ENEPIG, OSP, Immersion Silver and Immersion Tin | Finish recommendation based on frequency, assembly, reliability and application requirements. |
| Verification & Test | Electrical test, TDR, microsection and dimensional inspection | Project-defined S-parameter or insertion-loss verification can be coordinated when specified in the approved test plan. |
| Quality Standards | ISO 9001, IATF 16949, GJB9001C, AS9100D | IPC-6012 Class 3/3A support for applicable projects. |
Capability limits depend on the selected laminate system, copper thickness, board construction, finished thickness and project-specific engineering review.
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