HDI PCB vs Traditional PCB(HDI PCB)
Get Custom Quote
PRODUCTS CENTER
| Capability Area | Manufacturing Capability | Engineering & Reliability Support |
|---|---|---|
| Overall Layer Count | 4–128 Layers | High-layer PCB stackup review, copper balance and lamination planning |
| ELIC / Any-Layer HDI | Up to 30-Layer ELIC / Every-Layer Interconnect | Advanced microvia architecture, registration and sequential lamination control |
| HDI Structures | 1+N+1 to 6+N+6, Any-Layer HDI, ELIC | Structure selection by BGA escape, routing density and reliability target |
| Sequential Lamination | Multi-Cycle Sequential Lamination | Layer registration, resin flow and material-movement compensation |
| Minimum Laser Microvia | 50µm Hole / 150µm Capture Pad | Laser drilling, dielectric thickness and capture-pad reliability review |
| Microvia Structures | Stacked, Staggered, Copper-Filled, Via-in-Pad | Microvia architecture, fatigue risk and interconnect reliability review |
| Blind Via Aspect Ratio | 1:1 | Via depth, dielectric thickness and copper filling review |
| Line / Space | 35µm / 35µm | Fine-line routing and fine-pitch BGA escape optimization |
| BGA Pitch | Down to 0.3 mm | Via-in-pad, solder mask registration and assembly risk review |
| Via-in-Pad | Copper-Filled and Capped Via-in-Pad | BGA, CSP and high-density pad structure optimization |
| Via Filling Depression | ≤8µm | Assembly flatness and via-in-pad reliability control |
| Registration Control | Layer Misalignment ±0.06 mm | Critical for stacked microvias, fine-pitch BGA and high-layer HDI structures |
| Mechanical Hole Capability | 0.15 / 0.30 mm Hole / Pad | Mechanical drilling, annular ring and connector fit review |
| PTH Aspect Ratio | Project-Specific; HDI Reference 6:1 | Higher aspect ratio requirements should be confirmed by engineering review |
| Controlled Impedance | Project-Specific, Typically ±5% | Stackup, dielectric thickness, copper roughness and trace-geometry review |
| PCB Thickness | 0.2–4.0 mm for Advanced HDI Structures | Finished thickness depends on layer count, material system and copper weight |
| Copper Thickness | 1 oz Typical for Fine-Line HDI; Project-Specific Options | Etching compensation, impedance control, plating and thermal review |
| Warpage | ≤0.5% | Copper balance, thin-core and lamination-structure review |
| Surface Finishes | ENIG, ENEPIG, OSP, ImmAg, ImmSn, Hard Gold | Finish selection by assembly, connector, wire bonding and reliability requirement |
| Material Systems | FR-4, High-Tg FR-4, Megtron, Rogers, PTFE | Material selection by density, signal speed, thermal target and reliability requirement |
| Reliability Verification | Microsection, Thermal Stress, Continuity Testing, Impedance Testing | Microvia integrity, plating quality and interconnect reliability review |
| Quality Standards | ISO 9001, IATF 16949, GJB9001C, AS9100D | IPC Class 3 / 3A build requirements for high-reliability HDI projects |
Get Custom Quote
PRODUCTS CENTER
World-class PCB & PCBA manufacturer focused on high-frequency and high-reliability boards for defense, aerospace, automotive and industrial electronics.
You can unsubscribe at any time with a single click.
Copyright © 2025 UltroNiu Electronics Group All Rights reserved.
Business License