VIPPO Process Capability for Planar High-Density BGA Interconnects

2026-03-27

VIPPO is a critical capability for dense BGA breakout and high-performance HDI assembly because it combines via filling, planarization, and copper plating into a plated-over pad structure. This document outlines the process controls, design rules, inspection methods, and reliability checks needed to keep VIPPO structures manufacturable and repeatable.

Contents

VIPPO process fundamentals and engineering principles
Standard via-in-pad vs. plated-over structures
Pad design, microvia dimensions, and stackup planning
Laser drilling, filling materials, curing, and leveling
Copper plating over filled vias and solder joint reliability
X-ray, microsection, electrical testing, and DFM strategy

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