Laser Drilling Capability for HDI PCB Microvia Precision

2026-03-27

Laser drilling is one of the defining process capabilities behind modern HDI PCB fabrication. This document outlines how drilling technology, material response, heat control, pad alignment, and downstream plating performance affect microvia quality, manufacturability, and long-term interconnect reliability.

Contents

Laser drilling in HDI PCB manufacturing
Mechanical drilling vs. laser drilling
CO₂, UV, and hybrid drilling systems
Microvia diameter, aspect ratio, and tolerance control
HAZ, smear, debris removal, and surface preparation
Inspection, electrical testing, reliability testing, and scale-up

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