Sequential Lamination Capability for Complex HDI Stackups

2026-03-27

Sequential lamination is central to complex HDI manufacturing because it enables build-up layers, blind vias, stacked microvias, and any-layer structures that cannot be achieved in a single press cycle. This document covers lamination planning, resin flow, thickness control, alignment, and reliability management across repeated build cycles.

Contents

Sequential lamination fundamentals
Build-up structures and blind via formation
Stacked vs. staggered microvia planning
Material behavior, resin flow, pressure, and temperature control
Registration and defect risks across lamination cycles
Inspection, cross-section analysis, testing, and DFM strategy

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