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Material: PTFE · Dk 3.00 Loss: Df 0.0010 @10GHz Use: 77GHz Radar · mmWave
Rogers RO4003C Low-Loss High-Frequency Laminate PCB Manufacturing
Material: RO4003C Use: RF · Antenna · Filters Process: FR4-Compatible
Materials: Rogers · FR-4 Structure: Mixed Dielectric Stackup Support: Stackup · Impedance · DFM
Material: PTFE · Dk 2.20 Loss: Df 0.0009 @10GHz Use: Antenna · Radar · SATCOM
Laminate: RO4350B Bonding: RO4450F Support: Stackup · Impedance · DFM
Project Stage: POC · Evaluation · NPI Structures: Microstrip · Stripline · GCPW Support: Stackup · DFM · Verification
Layers: Multiple RF Signal Layers Routing: Stripline · Via Transitions Control: Planes · Registration · Backdrill
Systems: Network · VPX · AI/HPC Process: Press-Fit · Backdrill Control: TDR · Slot Accuracy
Boards: Development · PCIe · FMC+ Interfaces: DDR · SerDes · JESD204 Process: HDI · Via-in-Pad · Backdrill
Featured PCB & PCBA Case Studies
16-Layer Any-Layer HDI PCB
A 16-layer Any-Layer HDI architecture used stacked microvias and fine-line routing to reduce board area by 30% for a compact implantable medical device.
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40% Better Cooling for 800V EV Power Modules with Embedded Copper & Heavy Copper
Overheating threatened reliability. We embedded copper busbars and applied selective heavy copper—transforming the PCB into an active power path, cutting peak temperature by 40% for safe continuous operation.
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24/7 Reliability for Smart City Surveillance with High‑Tg & Blind/Buried Via
Intermittent failures after thermal cycling? We used high‑Tg/low‑CTE materials, blind/buried vias, and thick gold plating—eliminating via fatigue for continuous outdoor operation.
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Copper Inlay & Hybrid Lamination for High‑Power Robotics Thermal Management
A 120A servo drive overheated under continuous load. We embedded copper inlays for direct heat paths and used hybrid lamination to separate power from signal—achieving stable operation without bulky cooling.
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Solving Rigid‑Flex Failure in High‑Vibration Aerospace Systems
Intermittent signal drops and thermal cycling failures traced to rigid‑flex transitions. We smoothed the transition, rebalanced the 14‑layer stack‑up, and tightened process controls—eliminating failure under vibration.
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224Gbps AI Server PCB: From Signal Collapse to Stable Channel
Closed eye diagram and excessive loss at 224Gbps? We redesigned the channel, switched to Megtron 7, and applied sub‑8mil backdrilling—recovering a clean eye diagram and stable transmission.
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PCB Product Selection & Quotation FAQ
What files are needed to quote a microwave PCB with controlled impedance?
Gerber/ODB++, target impedance list, stack-up intent (or constraints), coupon requirements, and any critical RF routing notes.
Do you support “thin copper” or local copper optimization for sharper RF corners?
It can be supported when the design requires it; local thin-copper processing may improve corner accuracy versus full-board copper tolerance control.
Do you have real RF performance validation data?
Yes. The microwave filter bandwidth target is 5.7–7.0GHz; measured test is 5.86–7.19GHz, matching within <5% deviation.
What impedance tolerance can you support for this build?
This design targets ±5% impedance tolerance with verification and process locking for consistency.
Why use resin-filled vias on high-frequency microwave boards?
Resin-filled vias improve surface planarity and reduce solder wicking/void-related risk, supporting reliable RF assembly.
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Core PCB and PCBA technologies supporting RF, high-speed, HDI, flex, power electronics and complex multilayer projects.
Submit Your PCB or PCBA Project for Engineering Review
Upload your Gerber or ODB++, fabrication drawing, stackup, BOM and project requirements. Our engineering team will review the manufacturing scope, technical risks and quotation requirements.
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