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Four Key Factors Determining RF PCB Performance — Physics Over Schematics
Identical RF schematics often diverge above 10–40 GHz. Learn how dielectric stability, copper roughness, stack-up physics and process variation deterministically set real RF PCB performance.
2026-01-07
D-Coupon Verification of Microvia Lifetime | HDI Reliability Method
Microvias are often the weakest link in HDI. This article shows how D-Coupon thermal cycling, ΔR curves and failure analysis translate microvia structures into lifetime data for Class 3 and high-reliability HDI applications.
2025-12-17
D-Coupon Design Mastery | IPC-2221B & IPC-TM-650 2.6.27
A D-Coupon is only useful if it mirrors the real board. Learn how to design D-Coupons that match HDI stack-ups, via structures and trace geometry, and how IPC-2221B and IPC-TM-650 2.6.27 turn those designs into meaningful lifetime data.
2025-12-17
After 1000 Thermal Cycles, Can Microvias Survive? | IPC-TM-650 2.6.27
Power on, power off, repeat — each cycle ages microvias. Using IPC-TM-650 2.6.27, this piece explains how D-Coupons, ΔR thresholds and thermal cycling at 0–150 °C reveal whether stacked HDI microvias can truly survive 1000 cycles.
2025-12-16
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