Flexible Manufacturing Capabilities(Low Volume Production)

Capability

Description

Quick Changeover Lines

Modular SMT lines designed for rapid product setup and batch change, minimizing downtime between builds.

Prototype-to-Production Transition

Seamless process transfer from engineering prototypes to scalable pilot or mid-volume runs.

Multi-Technology Assembly

Support for SMT, THT, and mixed technology assemblies across rigid, flex, and rigid-flex boards.

Precision Component Handling

Placement accuracy up to ±25 µm, capable of handling 01005, BGA, QFN, and fine-pitch ICs.

Material Flexibility

Compatible with FR-4, Rogers, PTFE, aluminum, polyimide, and hybrid stack-ups.

Small-Batch Process Control

DFM/DFT validation, AOI, X-ray, and flying probe testing ensure prototype reliability.

Engineering Collaboration

Dedicated NPI engineers and real-time feedback for design optimization and yield improvement.

Turnkey & Consignment Options

Full or partial component sourcing, BOM validation, stencil fabrication, and box build.